Space Research Lab
Space Research Lab
What is Kemurdzhian Youth Space Challenge?
HyeTech and Bazoomq are launching a nationwide student competition to send a sensing robot built and programmed by students all over Armenia into Space.
To rollout a campaign across Armenia and engage children interested in robotics education,
To drive support toward robotics and STEM education in Armenia,
To build a worldwide community of Armenians involved or interested in aerospace and robotics,
To create global awareness and top-tier press coverage about this innovative program happening in Armenia.
Open to youth aged between 12-21, who are residents of the Republic of Armenia,
Teams must consist of a minimum of three to a maximum of five members,
Students from different educational centers (schools, universities, colleges, etc.) can form teams and work together,
Teams can be assisted by experts and/or mentors, subject to terms and conditions listed below,
Payload must strictly adhere to the specifications below.
Payload maximum weight is 200 grams.
Payload should have its own power supply.
Payload must survive being carried by rocket. Total flight to 100-120km+ will take around 10-12 minutes.
Payload must be connected to the rocket radio-telemetry for data transfer.
Payload must survive being in space (100km+) for about two minutes.
Payload will not return.
Competing payloads should pass benchmarking tests like Thermal, Vacuum, G-force and Vibration tests.
More detailed specifications will be provided to participants.
What is the weight limitation?
What is the size or shape limitation?
How will it get to space?
Will it be taken to orbit?
Can we get our payload back?
Can we have our own radio for telemetry or data?
Can we include something alive in our payload (e.g., insects, or so)?
Can we have liquid in the payload?
Can we get power from a Rocket?
How can we get our experiment data?
How should we send our data? What are the communication protocols?
What are the Temperature Ranges to survive?
What are acceleration or other flight stress conditions?
Should we apply only when we have the final device?
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